Materials Science In Semiconductor Processing
簡(jiǎn)稱：MAT SCI SEMICON PROC
ISSN：1369-8001
ESSN：1369-8001
研究方向：工程技術(shù) - 材料科學(xué)：綜合
所屬分區(qū)：3區(qū)
出版地：ENGLAND
出版周期：Bimonthly
創(chuàng)刊時(shí)間：1998
Materials Science In Semiconductor Processing英文簡(jiǎn)介
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
Materials Science In Semiconductor Processing中文簡(jiǎn)介
《Materials Science In Semiconductor Processing》是一本由ELSEVIER SCI LTD出版商出版的專業(yè)工程技術(shù)期刊，該刊創(chuàng)刊于1998年，刊期Bimonthly，該刊已被國際權(quán)威數(shù)據(jù)庫SCI、SCIE收錄。在中科院最新升級(jí)版分區(qū)表中，該刊分區(qū)信息為大類學(xué)科：工程技術(shù) 3區(qū)，小類學(xué)科：工程：電子與電氣 3區(qū)；材料科學(xué)：綜合 3區(qū)；物理：應(yīng)用 3區(qū)；物理：凝聚態(tài)物理 3區(qū)；在JCR（Journal Citation Reports）分區(qū)等級(jí)為Q2。該刊發(fā)文范圍涵蓋工程：電子與電氣等領(lǐng)域，旨在及時(shí)、準(zhǔn)確、全面地報(bào)道國內(nèi)外工程：電子與電氣工作者在該領(lǐng)域取得的最新研究成果、工作進(jìn)展及學(xué)術(shù)動(dòng)態(tài)、技術(shù)革新等，促進(jìn)學(xué)術(shù)交流，鼓勵(lì)學(xué)術(shù)創(chuàng)新。2021年影響因子為4.644，平均審稿速度約1.7個(gè)月。
中科院分區(qū)最新升級(jí)版（當(dāng)前數(shù)據(jù)版本：2021年12月最新升級(jí)版）
| 大類學(xué)科 | 分區(qū) | 小類學(xué)科 | 分區(qū) | Top期刊 | 綜述期刊 |
| 工程技術(shù) | 3區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學(xué)：綜合 PHYSICS, APPLIED 物理：應(yīng)用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理 | 3區(qū) 3區(qū) 3區(qū) 3區(qū) | 否 | 否 |
中科院分區(qū)最新基礎(chǔ)版（當(dāng)前數(shù)據(jù)版本：2021年12月最新基礎(chǔ)版）
| 大類學(xué)科 | 分區(qū) | 小類學(xué)科 | 分區(qū) | Top期刊 | 綜述期刊 |
| 工程技術(shù) | 3區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學(xué)：綜合 PHYSICS, APPLIED 物理：應(yīng)用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理 | 3區(qū) 4區(qū) 3區(qū) 3區(qū) | 否 | 否 |
中科院JCR分區(qū)歷年趨勢(shì)圖
JCR分區(qū)（當(dāng)前數(shù)據(jù)版本：2021-2022年最新版）
| JCR分區(qū)等級(jí) | JCR所屬學(xué)科 | 分區(qū) | 影響因子 |
| Q2 | MATERIALS SCIENCE, MULTIDISCIPLINARY | Q2 | 4.644 |
| PHYSICS, APPLIED | Q2 | ||
| PHYSICS, CONDENSED MATTER | Q2 | ||
| ENGINEERING, ELECTRICAL & ELECTRONIC | Q2 |
期刊指數(shù)
| 影響因子 | h-index | Gold OA文章占比 | 研究類文章占比 | OA開放訪問 | 平均審稿速度 |
| 4.644 | 49 | 1.53% | 98.85% | 未開放 | 約1.7個(gè)月 |